EP3C25F256I7N_Best Components (HK) Co., Ltd.

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EP3C25F256I7N

Manufacturer's number EP3C25F256I7N
Manufacturer Intel
Detailed IC FPGA 156 I/O 256FBGA
Detailed Description

Documents & Media

Datasheets	Cyclone III Family Overview Cyclone III FPGA Family Errata Cyclone III Device Handbook Vol2 Cyclone III Device Handbook Vol1 Virtual JTAG Megafuntion User Guide
Product Training Modules	Cyclone® III FPGA Designing an IP Surveillance Camera Three Reasons to Use FPGA's in Industrial Designs
Design Resources	Development Tool Selector
PCN Design/Specification	Substrate/Wire 10/Jun/2010 Cyclone Material Chgs 15/Jul/2016
PCN Packaging	Mult Dev Dessicant Chg 19/Jul/2019 Mult Dev Label CHG 24/Jan/2020
HTML Datasheet	Cyclone III Brochure Cyclone III Datasheet Cyclone III Family Overview
Online Catalog	Cyclone® III

Product Attributes

TYPE	DESCRIPTION	SELECT ALL
Categories	Integrated Circuits (ICs)
Categories	Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer	Intel
Series	Cyclone® III
Packaging	Tray
Part Status	Active
Number of LABs/CLBs	1539
Number of Logic Elements/Cells	24624
Total RAM Bits	608256
Number of I/O	156
Voltage - Supply	1.15V ~ 1.25V
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	256-LBGA
Supplier Device Package	256-FBGA (17x17)
Base Part Number	EP3C25

Environmental & Export Classifications

RoHS Status	RoHS Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Additional Resources

Standard Package	90
Other Names	544-2543 971612

Product inquiry

Best Components (HK) Co., Ltd. Is a professional electronic components distributor for BOM list project, Hard to Find, Long Lead-Time, End-Of-Life (EOL) and Obsolete Electronic Components., the most widely used for Smart products, Communications-equipments, Tracing products and Military Field. With office in shenzhen and warehouse in HongKong.

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Address: Rm 4513 Duhui Xuan building zhonghang road, Shenzhen, China 518031